| 摘要 |
<p>PURPOSE:To improve moisture resistance strength by preventing crack of a sealing resin and release of a chip on solder packaging. CONSTITUTION:A chip 1 and a lead frame 2 are mounted on a lower resin 3, the chip 1 and the lead frame 2 are connected by a bonding wire 4, the chip 1, the bonding wire 4, and one part of the lead frame 2 are sealed by an upper resin 5, and then the chip is mounted without going through the lead frame 2. Therefore, the surround of the chip 1 is sealed only with the upper resin 5 and the lower resin 3, thus dissipating thermal stress on solder packaging uniformly and preventing crack and release from occurring easily.</p> |
