| 摘要 |
The rod base material for wafers comprises a plurality of rod members made of materials to be used as the wafers used for electronic devices which are assembled in parallel and bonded with each other into an integrated body. Wafers used for electronic devices can be obtained by slicing the rod base material for the wafers. Mirror-finished bonded face is formed to the outer surface for each of the rod members. The bonded face to each of the rod members is cleaned by a surface treatment using chemicals. Subsequently, respective rod members are assembled in parallel and brought into contact with each other at their respective bonded faces. The thus prepared rod base material are maintained in a heated atmosphere into an integrated body. Then, the rod base material is applied with slicing for providing wafers used for electronic devices. Since the rod base material has a structure in which a plurality of the rod members are assembled in parallel and bonded with each other into an integrated body, the diameter for the rod base material can remarkably be increased. Accordingly, the diameter of the wafers obtained by slicing the rod base material is also increased remarkably. Since the wafer diameter is increased remarkably, the cost per one electronic device formed on the wafer is also reduced remarkably. |
