Palladium welding of a semiconductor body

摘要

A method of bonding together two dissimilar planar bodies, one of which is a semiconductor. A film of palladium is deposited on one of the bodies. The two bodies are pressed together with moderate force with the palladium in between. The palladium chemically reacts with the semiconductor and, at least in the case of GaAs, dissolves the surface oxide and forms a crystalline palladium/semiconductor product topotaxial with the semiconductor.