| 摘要 |
<p>PURPOSE:To provide a semiconductor device, in which there is no possibility of the failure of a semiconductor base body at the time of transport, etc., even without a special instrument, and an assembling method thereof. CONSTITUTION:In a semiconductor device, in which a semiconductor base body 2 is housed in a casing 7 under the state, in which the base body 2 is held by external electrodes 10A, 10K through a first electrode 51 and a second electrode plate 61, the fringe of the first electrode plate 51 is projected from the fringe of the semiconductor base body 2, and a ring-shaped groove 51a having specified width including the projection section of the fringe of the semiconductor base body 2 along the fringe of the base body 2 is formed to one main surface of the first electrode plate 51. The ring- shaped groove 51a and the outer circumferential section of the semiconductor base body 2 are filled with a holding member for bonding, and the semiconductor base body 2 is fixed onto the first electrode plate 51. Accordingly, the semiconductor base body 2 is fastened onto the first electrode plate 51 under the state, in which the base body 2 is protected by the holding member for bonding so as to cover the end section of the base body 2, thus using the first electrode plate 51 as a reinforcing plate, then preventing the failure of the semiconductor base body 2 even when the semiconductor device receives an impulse from the outside at the time of conveyance.</p> |
