MANUFACTURE OF ELECTRONIC COMPONENT MOUNTING BOARD

摘要

PURPOSE:To enhance heat dissipation effect of electronic components by press fitting a heat dissipation member substantially in flush with the opposite surfaces of an insulating board and metallizing the entire surface there of and then patterning a conductor circuit through etching. CONSTITUTION:A hole 3 is made in an insulating board l through press and a heat dissipating metal rod 5 substantially as thick as the board 1 is press fit therein so that the rod 5 is flush with the component mounting surface of the insulating board 1. The board 1 is then metallized 6 with copper or nickel on the entire surface thereof, photosensitive resin is applied thereon and subsequently etched to form patterned conductor circuits 7 or die patterns 10 on the opposite surfaces of the board 1 while furthermore solder resist films 8 are formed at predetermined parts. Solder bumps 9 are then formed on the bottom face of the board 1 and an electronic component 11 is mounted on the die pattern 10 and wired through a bonding wire 12 with the patterned conductor circuit 7. This method produces a cheap electronic component mounting board which is excellent in heat dissipation effect of electronic component and for which mass-productivity is promoted through simplification of manufacturing process.