EPOXY RESIN COPPER-PLATED LAMINATE

摘要

PURPOSE:To manufacture an epoxy resin copper-plated laminate of superior resistance to heat and resistance to water and low dielectricity properties. CONSTITUTION:2-sea-butyl-4-[ l-[4-[3-sec-butyl-4-hydroxyphenyl]-4- methylcyclohexyl]-1-methylethyl] phenol is synthesized by 2-sec-butylphenol and dipentane, and then an epoxy compound prepared by reacting with epichlorohydrin and an epoxy resin composition containing dicyandiamide are dissolved in an organic solvent to prepare resin varnish and a prepreg manufactured by impregnating a glass cloth with varnish is laminated with copper foil and press molded to manufacture a copper-plated laminate.