| 摘要 |
PURPOSE:To enhance electrical reliability of semiconductor device and to increase yield in the bonding process of semiconductor device. CONSTITUTION:A square semiconductor pellet 2 includes an element forming surface having at least one side arranged with a plurality of external terminals 3 connected, respectively, through bonding wires 5 with a plurality of lead wires 4A arranged on one outer side opposing to one outer peripheral side of the semiconductor pellet 2. The plurality of lead wires 4A arranged oppositely to one side of the semiconductor pellet 2 are divided, along the arranging direction, into a plurality of lead groups 6 in which the space between one side of the semiconductor pellet 2 and the lead wires 4A1 arranged at initial and final stages in the arranging direction of the lead wires 4A is set shorter than the space between one side of the semiconductor pellet 2 and the lead wires 4A2 arranged at intermediate stage. |
