| 摘要 |
PURPOSE:To reduce impedance by using a multi-layer printed wiring board for the board of the substrate of an IC socket, and forming the printed wiring for the power and grounding in the board into a plane pattern. CONSTITUTION:Positioning is made with guide pins 4 and holes 10 of a film 5 so that the conducting grains 9 of the anisotropic conducting film 5 are brought into contact with inner pads 8 on a multi-layer printed wiring board 3. When an IC 1 is fitted to an IC insertion hole 16, the IC 1 is positioned with the guide pins 4 and the guide holes 18 of an insulating substrate 11 so that leads 2 are located immediately above the conducting grains 9, it is fitted along the pins 4, and it is fixed to the board 3 with screw holes 17 and screws 15. When the IC 1 is inserted along the hole 16 of the substrate 11, the leads 2 are brought into contact with the conducting grains 9. When a cover 13 is fitted and fixed with a stopper 12, the projection 14 of the cover 13 presses the IC 1, the connection among the leads 2, conducting grains 9, and inner pads 8 is secured, and the IC 1 is connected to an external apparatus by external pads via through holes 7. |
