| 摘要 |
PURPOSE:To provide a multi-chip module structure where a large number of outer connection terminals can be provided to a board of small scale by a method wherein the multi-chip module structure mounted with semiconductor chips and chip components is improved by providing a guide frame to both the sides of a board to mount components on both the sides of the board. CONSTITUTION:A semiconductor chip 4 connected by bonding wires 5 and a chip component 6 are mounted on the front and the rear side of a board 1, where bonding pads 1a are formed on the peripheral part of the board 1 to be electrically connected to the outside, a guide frame 2 is provided to one side of the board 1, a guide frame 3 is provided to the other side of the board 1, and a spot coat 7 covering the semiconductor chip 4 and the bonding wire 5 and a sheathing material 8 filled into an empty space surrounded with the board 1 and the guide frames 2 and 3 are provided. |
