| 摘要 |
PURPOSE:To minimize an actual area for mounting a semiconductor chip without lowering the mounting strength. CONSTITUTION:A semiconductor chip 11 is mounted on a circuit board 13. An outer sealing material 16 made of resin with a high viscosity of 50000 to 100000cp is applied to a space between the circuit board 13 and the bottom surrounding part of the semiconductor chip 11 except for places of two openings 17. The outer sealing made of a highly viscous material is not allowed to enter a gap between a center bottom part of the semiconductor chip 11 and the circuit board 13. Also, the outer sealing can not much protrude from a mounting area of the semiconductor chip 11. Then, an inner sealing material 18 of resin with a lower viscosity of 1000 to 10000cp is injected into the inside space of the outer sealing material through one of the openings 17 so that a gap between the semiconductor chip 11 and the circuit board 13 is filled while an air between these places is discharged through the other opening 17. |
