| 摘要 |
PURPOSE:To easily perform dicing with a high precision and simplify inspection process of cut out array chips by making decision dicing line easy. CONSTITUTION:A plurality of light emitting elements 15 consisting of light emitting sections 13 and electrodes 14 are arranged at a constant pitch on an epitaxial wafer 10. At an outside of the utmost outside light emitting element 15a, a length discrimination pattern 20 is formed. The length discrimination pattern 20 is provided on both sides of end parts. The pattern 20 is preferably provided with at least three stepped parts such as a stepped part 21a for displaying the largest notched line, a stepped part 21b for designating an optimal dicing line 18, and a stepped part 21c for displaying a limit line. Thus, when upper and lower length discrimination patterns 20, 20 are to be connected, a predetermined dicing line 18 can be decided easily. The length of cut out array chip can be obtained easily by inspecting which part of the length discrimination pattern 20 is cut off. |
