| 摘要 |
PURPOSE:To ensure airtightness in an internal cavity of a cover body by forming a resin coat of soft synthetic resin at a part to which at least the bottom face of the cover body among surfaces of a head substrate abuts. CONSTITUTION:When a cover body 15 and a radiator 14 which pinch a head substrate 11 between them are fastened, a resin coat 19 made of soft synthetic resin formed so as to extend on the whole face on the top surface of the head substrate 11 is pinched between the head substrate 11 and the cover body 15. Further, when the cover body 15 and the radiator 14 are going to be fastened, the resin coat 19 adheres to the cover body 15 so as to function as a sealing gasket, so that airtightness in an internal cavity of the cover body 15 can be ensured. Also, since formation of protective films for LED chip arrays 12 and driving ICs 13 and formation of the resin coat 19 can be performed at the same time, process can be simplified. |
