| 摘要 |
PURPOSE:To improve reliability by fixing a space between a sealing cap and an IC chip. CONSTITUTION:The periphery of the IC chip mounting part on a wiring board 2 is formed a step lower than an IC chip mounting pad 8. The opening edge of a cap 9 is bonded to the bottom part 21 through sealing material 22. The space between the IC cap 1 and the cap 9 is varied by vertically moving the cap 9 along the side plane 24 of the bottom part 21. Thus, the nonuniformity of the mounting height and inclination of the IC chip 1 and the depth of the cap are absorbed. The thickness of adhesive between the IC chip 1 and the cap 9 be thinned to reduce heat resistance and cooling performance is improved. |
