MANUFACTURE OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PELLET USED FOR IT

摘要

PURPOSE:To reduce loop height of a bonding wire and then make a semiconductor device to be thin by providing a pad on the side surface of a semiconductor pellet and then connecting it to a lead with a wire. CONSTITUTION:A semiconductor pellet 1 is mounted onto a tab 2 which is formed by 42 alloy etc. with an adhesive such as Ag paste and a pad 3 which becomes an electrode is formed on the side surface part. The tab 2 is connected to a lead 5 which is extended around it with a bonding wire 4 which is made of Au and the surrounding is sealed by resin. In this manner, the pad 3 can be formed on the side surface of the semiconductor pallet 1 and the pad 3 and the lead 5 are connected thus virtually ignoring the loop height of the bonding wire 4 and achieving an extremely thin package.