PLASTIC SEALED SEMICONDUCTOR DEVICE, MEMORY CARD USING THIS DEVICE AND MANUFACTURE THEREOF

摘要

PURPOSE:To make it possible to mount a plastic sealed semiconductor device on a printed board at a high density. CONSTITUTION:A memory card is provided with a plastic sealed semiconductor device 10 with leads turned both upwards and downwards that has a lead 10A turned downwards and a lead 10B turned upwards; a plastic sealed semiconductor device 11 with both leads turned downwards that has a lead 11A turned downwards and a lead 11B turned downwards ; and a plastic sealed semiconductor device 12 with leads both turned upwards and downwards that has a lead 12A turned upwards and a lead 12B turned downwards.