| 摘要 |
PURPOSE:To prevent the characteristics of a title device from being badly affected by effectively dispersing heat produced from a semiconductor pellet to the outside of the device. CONSTITUTION:A semiconductor device comprises a semiconductor pellet 2 mounted on a bed 1, a lead 3 disposed around the bed 1, and a bonding wire 5 for interconnecting between the lead 3 and an electrode 4 of the semiconductor pellet 2, in which device the bed 1, the semiconductor pellet 2, part of the lead 3, and the bonding wire 5 are sealed with resin 6 such that the external end of the lead 3 is protruded. At least two power supply leads 3a of the lead 3 are formed in a united or coupled state with the bed 1. |
