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发明名称
METHOD OF SEALING SEMICONDUCTOR CHIP WITH RESIN AND SEMICONDUCTOR PACKAGE
摘要
申请公布号
JPH05291435(A)
申请公布日期
1993.11.05
申请号
JP19920120020
申请日期
1992.04.14
申请人
NIPPON STEEL CORP
发明人
KUNII NORIO
分类号
H01L23/28;(IPC1-7):H01L23/28
主分类号
H01L23/28
代理机构
代理人
主权项
地址
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