SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF

摘要

PURPOSE:To make it possible to use a semiconductor device as either a normal bend type or an inverted bend type. CONSTITUTION:A lead used for electrically connecting an IC chip with the outside is made up of an inner lead 3, electrically connected to the IC chip and disposed within a package, and a conductor 5 electrically connected to the inner lead 3 with a part of the conductor projecting from both surfaces of the package as external terminals 7a and 7b.