| 摘要 |
PURPOSE:To provide a semiconductor device manufacturing method by which a large amount can be treated at once and, at the same time, the kind of machines used for small-lot multiple-kind production can be easily switched and a semiconductor element can be positioned and mounted with high accuracy without using any expensive member. CONSTITUTION:The base-material metallic plate for a lead frame 3, etc., solder 2, and semiconductor element 1 are positioned by closely adhering and fixing the metallic plate, solder 2, and element 1 to each other by utilizing the surface tension of pure water layers respectively interposed between each of them. Therefore, the element 1 can be positioned with high accuracy without using any expensive member. When they are heated in a solder reflow furnace, a large amount can be treated at once and switching of the kind of machines for small-lot multiple-kind production becomes easier. Since the contamination of the semiconductor element with scattered fluxes is prevented by using nonflux type solder in a reducing atmosphere, the yield does not decline.
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