METHOD FOR FORMING SOLDER LAYER ON PRINTER-CIRCUIT BOARD,申请号JP19920112118-传众专利搜索

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发明名称	METHOD FOR FORMING SOLDER LAYER ON PRINTER-CIRCUIT BOARD
摘要
申请公布号	JPH05283855(A)	申请公布日期	1993.10.29
申请号	JP19920112118	申请日期	1992.04.03
申请人		发明人
分类号	H01L21/60;H01L23/12;H05K3/34;(IPC1-7):H05K3/34	主分类号	H01L21/60
代理机构		代理人
主权项
地址

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