Herstellungsverfahren von optischen Anordnungen und Halterungen.

摘要

In packaging an optical device 61 on a sapphire substrate 21 the substrate is cut away to form a depression 52 having inclined sides 51 so that edges of an electroconductive paste 54 located on the inclined sides 51 does not protrude above the remainder of the paste 54 even after firing to provide a substantially flat die bonding pad 23. The optical device 61 has a thin solder layer 66 applied to its electrode 65 surrounding a light transmitting surface 67 of the device and this thin solder layer 66 is used to mount the device 61 on the die bonding pad 23.