发明名称 Reducing gas recirculation in thermal processing furnace
摘要 A tube furnace used for high-temperature processing of semiconductor wafers or the like employs features to improve the gas flow. One feature is reducing, or essentially eliminating, regions of gas recirculation in the outer annular region inherently present in a horizontal hot-wall atmospheric oxidation reactor equipped with a tubular cantilever for holding semiconductor wafers. The annular region is effectively isolated from the rest of the reactor by a solid circular quartz ring or barrier formed on the inner wall of the furnace tube, acting as a physical barrier against gas penetration inside the outer annulus.
申请公布号 US5256060(A) 申请公布日期 1993.10.26
申请号 US19920827003 申请日期 1992.01.28
申请人 DIGITAL EQUIPMENT CORPORATION 发明人 PHILIPOSSIAN, ARA;CULLEY, EDWARD W.
分类号 C23C16/455;C30B25/14;C30B31/16;(IPC1-7):F27D3/00 主分类号 C23C16/455
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