发明名称 Tapered thermal substrate for heat transfer applications and method for making same
摘要 A tapered thermal substrate for transferring heat generated from a heat source to a heat sink comprising a composite core of parallel layers of thermally conductive fibers, the core having a tapered edge that maximizes fiber end exposure to the heat source or sink. The tapered edge is comprised of at least one angled surface formed by machining the composite core. A copper thermal tab is plated to each angled surface and machined to a desired size and shape to provide a contact surface for the heat source or sink and a means for facilitating transfer of generated heat to and from the fiber ends. A flashing of a thin coating of copper and nickel over the composite core and each copper thermal tab is also provided to environmentally seal the composite core.
申请公布号 US5255738(A) 申请公布日期 1993.10.26
申请号 US19920915460 申请日期 1992.07.16
申请人 E-SYSTEMS, INC. 发明人 PRZILAS, MARK B.
分类号 B32B5/08;F28F21/00;H05K7/20;(IPC1-7):F28F7/00 主分类号 B32B5/08
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