METODO PARA DEPOSICAO SOBRE UMA SUPERFICIE DE UM MATERIAL E ESTRUTURA PARA PROVISAO DE INTERCONEXAO ELETRICA A UMA MICROPLAQUETA SEMICONDUTORA QUE O UTILIZA

摘要

Silicon and germanium containing materials are used at surface of conductors in electronic devices. Solder can be fluxlessly bonded and wires can be wire bonded to these surfaces. These material are used as a surface coating for lead frames for packaging integrated circuit chips. These materials can be decal transferred onto conductor surfaces or electrolessly or electrolytically disposed thereon.