发明名称 Integral semiconductor wafer map recording
摘要 A method for integral semiconductor wafer map recording which comprises a semiconductor wafer (11) having a plurality of individual die (12, 13) thereon. Testing each of the individual die (12). Summarizing the results of the testing in a wafer map. Recording the wafer map on the semiconductor wafer (11) by laser scribing a binary code (19) within inactive die (13).
申请公布号 US5256578(A) 申请公布日期 1993.10.26
申请号 US19910812344 申请日期 1991.12.23
申请人 MOTOROLA, INC. 发明人 CORLEY, DEAN;LITTLEBURY, HUGH W.
分类号 H01L21/02;H01L21/66;H01L23/544;(IPC1-7):H01L21/66 主分类号 H01L21/02
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