发明名称 |
Method of growing device quality InP onto an InP substrate using an organometallic precursor in a hot wall reactor |
摘要 |
An organometallic precursor as for example trimethyl indium (TMI) is co-injected with HCl into a hot wall reactor to form volatile InCl, and PH3 is used as the phosphorus source. Layers of InP are grown at approximately 8 mu m/hr with excellent morphology and good electrical properties. Hall measurements at 77K show background n-type conductivity with n=7x1015/cm3 and mu S 34,000 cm2/V-s. The method is capable of growing ternary and quaternary heterostructures with thin layers and abrupt junctions.
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申请公布号 |
US5256595(A) |
申请公布日期 |
1993.10.26 |
申请号 |
US19930019508 |
申请日期 |
1993.02.19 |
申请人 |
THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE ARMY. |
发明人 |
FLEMISH, JOSEPH R.;JONES, KENNETH A.;BAN, VLADIMIR S. |
分类号 |
H01L21/205;(IPC1-7):H01L21/205 |
主分类号 |
H01L21/205 |
代理机构 |
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地址 |
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