发明名称 Method of growing device quality InP onto an InP substrate using an organometallic precursor in a hot wall reactor
摘要 An organometallic precursor as for example trimethyl indium (TMI) is co-injected with HCl into a hot wall reactor to form volatile InCl, and PH3 is used as the phosphorus source. Layers of InP are grown at approximately 8 mu m/hr with excellent morphology and good electrical properties. Hall measurements at 77K show background n-type conductivity with n=7x1015/cm3 and mu S 34,000 cm2/V-s. The method is capable of growing ternary and quaternary heterostructures with thin layers and abrupt junctions.
申请公布号 US5256595(A) 申请公布日期 1993.10.26
申请号 US19930019508 申请日期 1993.02.19
申请人 THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE ARMY. 发明人 FLEMISH, JOSEPH R.;JONES, KENNETH A.;BAN, VLADIMIR S.
分类号 H01L21/205;(IPC1-7):H01L21/205 主分类号 H01L21/205
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