| 摘要 |
<p>PURPOSE:To metal-plate an exposed surface of resin with which a through hole is filled in by using a prepreg impregnated with thermosetting resin composition in which a special amount of aliphatic aminosilane coupling agent-treated glass powder is mixed. CONSTITUTION:A through hole printed circuit board in which a printed circuit network for an inner layer is formed on one side of a double-sided copper-clad laminated board as a laminated material for forming at least one side of a multilayer board is used. After the surface of the copper foil is chemically treated, a prepreg, a printed circuit board for an inner layer when required, and a copper foil or a single-sided copper-plated laminated board is combined as a laminated board, multilayered as a multilayer board, then a through hole is opened, through hole-plated, and a surface layer printed circuit network is formed. As prepreg to be used for adhering the through hole circuit boards, it is impregnated with thermosetting resin composition mixed with 2-40wt.% of aliphatic aminosilane coupling agent-treated glass powder for use.</p> |
