| 摘要 |
PURPOSE:To enhance yield by providing a power source pattern connected at a starting end to a power source pad of a stepped end and connected at a terminating end to a first power source pad formed on a surface of a multilayer circuit board. CONSTITUTION:The semiconductor device comprises a box-shaped multilayer circuit board 3 opened at an upper surface, a semiconductor chip placed at a center of the board 3, etc. A power source pattern 61-1 connected at a starting end to a power source pad 61-1a of a stepped end 33 and connected at a terminating end to a first power source pad 61-1b formed on a surface of the board 3 is provided. The other power source pattern 61-2 connected at a starting end to a second power source pad 61-2a formed oppositely to the pad 61-1b and connected at a terminating end to a third power source pad 61-2b connected to a power source electrode 11 of a semiconductor chip 1 through a wire 6 is provided. Thus, a short-circuit inspection of power source circuits formed of the chip 1 and the board 3 can be executed before it is sealed with a cover 9. |
