| 摘要 |
PURPOSE:To enable adherence strength between wire materials to be made large enough, even when relatively large electromagnetic force is induced, or when service environment is at relatively low temperature, by forming a through-hole on a polymeric sheet for allowing the penetration of epoxy molecules. CONSTITUTION:In an insulation sheet having the half-cured state of thermosetting epoxy resin formed at least on one side of a polymeric sheet, through-holes to allow the penetration of an epoxy molecule are formed in the polymeric sheet. In other words, many fine holes sufficiently larger than one molecule of epoxy resin in softened state are formed on the surface of an insulation polymeric sheet, thereby maintaining a flow passage of the resin between both sides thereof. As a result, the concentration of the epoxy resin at a specific section can be avoided, and adherence strength between the polymeric sheet and the resin increases. Thus, enough adherence strength between wire materials can be provided, even when a relatively large electromagnetic force is induced, or when service environment is at relatively low temperature. |
