High current command semiconductor circuit package for cars - has power transistor mounted at lower level with command transistor mounted above with interconnections.

摘要

The lower level board grid (4,5) is copper coated and houses the power transistor (14). Connection to tracks is via wire connections (15). The grid is connected to a heat sink (7). The lower connection extend to the upper level. The upper level has the command chip (16) mounted on a silvered board on the opposite side to the power chip. Fine wires (17) extend to the track. Thus both transistors are mounted in the same capsule with external connections. ADVANTAGE- The power and command transistors can be mounted in the same container without need for added structure. Formation of connection grille is simplified.