| 摘要 |
PURPOSE:To improve a productivity of bumps and prevent a residual cut part of a wire from protruding from the bump, by improving the method for forming the bump, wherein a wire bonder is utilized. CONSTITUTION:A ball 5 is formed at the end of a wire 2 passed through a capillary 1, and the ball is bonded to a board 3. The wire 2 is cut while pulling up the capillary 1, and thereafter, a residual part 2a of the wire 2, which is extended from the ball 5, is squeezed with the flat surface of a pressing tool. Alternatively, after bonding the ball 5 to the board 3 with the capillary 1, the ball is squeezed with the end of the capillary 1 which is moved in the lateral direction, and thereafter, the wire 2 is cut. |
