PACKAGE FOR ACCOMMODATING SEMICONDUCTOR ELEMENT,申请号JP19920073862-传众专利搜索

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发明名称	PACKAGE FOR ACCOMMODATING SEMICONDUCTOR ELEMENT
摘要
申请公布号	JPH05275482(A)	申请公布日期	1993.10.22
申请号	JP19920073862	申请日期	1992.03.30
申请人		发明人
分类号	H01L21/60;H01L23/50;(IPC1-7):H01L21/60	主分类号	H01L21/60
代理机构		代理人
主权项
地址

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