发明名称 Dynamic random access memory cell - has insulating film on word-line, covered by conductive layer, insulating layer and bit-line formed on insulating layer
摘要 The DRAM cell insulating film (7) is formed on a word line (4). The film is covered by a conductive layer (8) as a protection against capacitive coupling between the word and bit lines. The conductive layer is covered by a second insulating film (9). The latter supports a bit line (12) such that the potential of the word line is not affected by a transient signal applied to the bit line. Pref. the conductive layer may be under a preset potential of specified value, or as earth potential. The conductive layer typically consists of polycrystalline or amorphous silicon. In the mfr. of the cell the bit line and the memory electrode are coupled to a source or drain region of a MOSFET respectively. ADVANTAGE - Prevention of capacitive coupling between the word and the bit lines.
申请公布号 DE4312468(A1) 申请公布日期 1993.10.21
申请号 DE19934312468 申请日期 1993.04.16
申请人 HYUNDAI ELECTRONICS INDUSTRIES CO., LTD., ICHON, KYOUNGKI, KR 发明人 KIM, JAE-KAP, ICHON, KYOUNKGI, KR;CHUNG, IN-SOOL, ICHON, KYOUNGKI, KR
分类号 H01L27/04;H01L21/768;H01L21/822;H01L21/8242;H01L23/522;H01L27/10;H01L27/108;(IPC1-7):H01L27/108;G11C11/401;H01L21/72 主分类号 H01L27/04
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