| 摘要 |
The preventive method against discoloration and corrosion of a metal layer is characterized by (a) covering a protective film (2) and a photosensitive film (1) on the semiconductor substrate (4) formed with the metal layer (3), (b) defining an etched region of the film (2) by the partial photoetching process of the film (1), (c) wet etching the film (2) with an etching soln. (HHED; NH4H2O:H2NC2H4NH2= 73:27) to be 0.5 μm thickness, and (d) removing the residual the films (1,2) by the dry etching. The method improves a bonding characteristic of the metal layer and a conductive material.
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