| 摘要 |
PURPOSE:To provide a method for mounting a semiconductor element by which bumps having the constant variations in height can be connected to electrode terminals accurately. CONSTITUTION:By pushing a semiconductor element 1 against a mounting substrate 3, bumps 2 are inserted into recessed sections 4. So, even if the bumps 2 formed on the semiconductor element 1 vary in height, conductive grains 6 which have been injected into the recessed sections 4 are compressed and thereby all the bumps are inserted to enough depth into each of the recessed sections 4. Then, the bumps 2 and electrode terminals 5 are electrically connected through the conductive grains 6. |
