| 摘要 |
PURPOSE:To perform stable junction by arranging the constitution such that an inner lead does not resonate with ultrasonics when junctioning a fine metallic wire to the inner lead, in the lead frame of a semiconductor device sealed with resin wherein the heat radiation property is improved. CONSTITUTION:An insulator 1, the Young's modulus of which is 1X10<9> dyne/cm<2> or more at 180-230 deg.C in temperature, is buried between the leads 2 at the top of a lead frame.
|
