发明名称 BONDING METHOD OF DIAMOND
摘要 In the diamond bite, an insert with projected diamond tip is fixed in the insert hole of a defined depth, formed at upside of bite edge, by bolt and adhesive. A method for attaching the diamond tip to the end portion of insert comprises interposing an active silver solder between the diamond tip and the insert, and heating at 700-850 deg.C in a vacuum container of 10-5 torr. The solder is composed of 59-65 wt.% Ag, 12.5 wt.% In, 27.25-35.25 wt.% Cu and 0.25-1.75 wt.% Ti. The bite has a high strength and excellent workability.
申请公布号 KR930010203(B1) 申请公布日期 1993.10.15
申请号 KR19910005526 申请日期 1991.04.06
申请人 EHWA DIAMOND IND. CO., LTD. 发明人 CHOE, SONG - KUK;JONG, TAE - JO
分类号 B23P5/00;(IPC1-7):B23P5/00 主分类号 B23P5/00
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