发明名称 |
BONDING METHOD OF DIAMOND |
摘要 |
In the diamond bite, an insert with projected diamond tip is fixed in the insert hole of a defined depth, formed at upside of bite edge, by bolt and adhesive. A method for attaching the diamond tip to the end portion of insert comprises interposing an active silver solder between the diamond tip and the insert, and heating at 700-850 deg.C in a vacuum container of 10-5 torr. The solder is composed of 59-65 wt.% Ag, 12.5 wt.% In, 27.25-35.25 wt.% Cu and 0.25-1.75 wt.% Ti. The bite has a high strength and excellent workability.
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申请公布号 |
KR930010203(B1) |
申请公布日期 |
1993.10.15 |
申请号 |
KR19910005526 |
申请日期 |
1991.04.06 |
申请人 |
EHWA DIAMOND IND. CO., LTD. |
发明人 |
CHOE, SONG - KUK;JONG, TAE - JO |
分类号 |
B23P5/00;(IPC1-7):B23P5/00 |
主分类号 |
B23P5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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