发明名称 |
CONDUCTOR-FILLED THERMOSETTING RESIN |
摘要 |
Conductor-filled thermosetting resins having a free radical based cure chemistry are prepared for use as solder paste replacements for electrical conducting attachments of surface mount electronics components to printed circuit boards and as a die attach adhesive. The thermosetting resins exhibit rheological properties that allow them to be substituted for state-of-the-art solder paste and die attach adhesives. The conductor filled resins can be thermally cured in in-line processing operations to provide a low stress, substrate adherent, electrically conductive resin matrix. |
申请公布号 |
WO9320562(A1) |
申请公布日期 |
1993.10.14 |
申请号 |
WO1993US03314 |
申请日期 |
1993.04.01 |
申请人 |
THERMOSET PLASTICS, INC. |
发明人 |
JAMISON, WILLIAM, L.;MOSCICKI, ANDRZEJ, J. |
分类号 |
C08K3/08;H01B1/22;H01L23/482;H05K1/18;H05K3/32;(IPC1-7):H01B1/02;C08K3/10;B05D5/12;H01B1/06 |
主分类号 |
C08K3/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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