发明名称 DEVICE FOR INSPECTING PACKAGING OF CHIP COMPONENT
摘要 PURPOSE:To inspect chip components with high accuracy without being affected by characters on the upper surface of each chip component by generating an inspection range between two electrodes, and identifying faults by means of values measured after the area where light is reflected from the characters is eliminated. CONSTITUTION:A chip component 1 comprising an electrode 2 mounted on a pad 3 is illuminated 4 and a camera 5 outputs a density image signal (a) of the component 5. A binarizing circuit 6 converts the signal (a) into 1 (0) corresponding to the bright (dark) part and outputs a binarized image signal (b). A detection area generating circuit 7 to which the signal (b) is input generates an inspection range between the two electrodes of the component 1, the range being set by a stored inspection range signal (c), and a binarized image signal (d) of the inside of the inspection range from which only binarized images are extracted is output. A character image eliminating circuit 9 to which the signal (d) is input outputs a selected image signal (e) of only the data of 1-label whose length perpendicular to the inter-electrode direction is larger than a preset value. A judging circuit 10 measures the number of 1 when the signal (e) is input thereto, and recognizes the fault of longitudinal deviation when the measured value is larger than a preset criterion.
申请公布号 JPH05264222(A) 申请公布日期 1993.10.12
申请号 JP19920026330 申请日期 1992.02.13
申请人 发明人
分类号 G01B11/00;G01N21/88;G01N21/956;G06T1/00;G06T7/00;H05K13/08 主分类号 G01B11/00
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