| 摘要 |
PURPOSE:To thin down a package and to prevent defectives. CONSTITUTION:The chip mount part 11 of a lead frame 1 is shaped into a cross which combine counter ones of four suspension leads 12 in a striplike manner. The rear of a semiconductor chip 2 is provided with a groove 21 to insert the chip mount part 11, which is inserted and fixed in this groove 21.
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