| 摘要 |
<p>PURPOSE:To heat a bonding with a good response and prevent the breakage of a wiring, by applying a high-frequency current to a coil and generating an AC magnetic field and.performing an induction heating. CONSTITUTION:Inner leads 2 formed on a film carrier 1 are connected to electrode pads 4 of semiconductor chips 3. In this case, when operating a high-frequency power source 17 and applying the high-frequency power source 17 to a coil 16, an AC magnetic field is generated around a bonding tool 15. By this, an eddy current flows within the bonding tool 15 and an eddy current loss occurs. Also, since the bonding tool 15 is made of a magnetic substance, a hysteresis loss occurs. The hysteresis loss is converted into a heat energy and the bonding tool 15 is heated with a good response. Thus, a good bonding can be performed even if a soldering connection is used. Further, since the bonding tool 15 itself is not heated, a wiring is eliminated and the break of the wiring due to a vertical motion does not occur, and there is no fear of failure.</p> |
