发明名称 POSITIVE TYPE PHOTORESIST COMPOSITION
摘要 PURPOSE:To obtain a resist pattern superior in sensitivity, and developability, resolution, and heat resistance by using an alkali-soluble resin, a quinonediazido compound, and a specified compound. CONSTITUTION:The photoresist composition comprises the alkali-soluble resin, the quinonediazido compound, and the compound represented by the formula in which R is, independently H, a halogen, an alkyl, an alkoxy, a nitro, an alkenyl, an aryl, an aralkyl, an alkoxy- or an aryl-carbonyl, an acyloxy, an acyl, an aryloxy, or an aralkoxy; (l) is an integer of 1-4; (m) is 1, 2, or 3, and l+m=5; and (n) is 0 or 1. The alkali-soluble resin can be embodies by novolak resins, acetone-pyrogallol resins, polyhydroxystyrenes and their derivatives.
申请公布号 JPH05257275(A) 申请公布日期 1993.10.08
申请号 JP19920052732 申请日期 1992.03.11
申请人 发明人
分类号 G03F7/004;G03F7/022;H01L21/027;(IPC1-7):G03F7/022 主分类号 G03F7/004
代理机构 代理人
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