| 摘要 |
<p>PURPOSE:To improve high frequency characteristics by a method wherein the area of mounting is made small, and the stray capacitance and inductance due to the wiring on a printed substrate are reduced. CONSTITUTION:A plurality of resistors 2 to 4 are arranged on a substrate 5, they are series-connected, electrodes 6 and 7 are provided on the connection part of the resistors 2 to 4, and electrodes 8 and 9 are provided on both ends of the resistors 2 to 4. By providing the resistors 2 to 4 and electrodes 6 to 9, a chip type attenuator 1 is constituted. The attenuator is obtained by consisting a pi-type circuit. Also, by arranging the resistors 2 and 3 and electrodes 11 to 13, a chip type impedance converter 10 is constituted. As a result, an L-type circuit is formed, and the impedance converter is realized.</p> |
