| 摘要 |
PURPOSE:To improve the workability and reliability of wire bonding operation regarding a wire bonding device conducting bonding by pushing a tool against the conductor exposure section of a wire positioned onto the pad of a substrate. CONSTITUTION:A wire-feed section 10 provided with a wire connecting section 40 electrically connected at the end section of the winding-start side of a wire a and laser transmitter 50 for removing the coated section 1a of the wire held and fed to pinch rollers 15 at a position corresponding to the position of bonding and forming an exposed section 1b of the wire 1 are mounted. A tool 2 for bonding the wire 1 at its exposed portion 1b to the pad 3 of a substrate 4, an electric conduction detector 9 for detecting the electrical conduction between the tool 2 and the wire connecting section 40, and a controller 80 for controlling the operation of the tool 2 for holding an ultrasonic horn 5 vertically movably on the basis of a signal from the electric conduction detector 9 and the operation of the pinch rollers 15 are provided. |
