| 摘要 |
<p>PURPOSE:To obtain an AlN circuit board of high reliability wherein mirror surface polishing is not necessary to the substrate surface, defect like microcrack is not generated, and bond strength of I/O terminals is excellent. CONSTITUTION:The title circuit board consists of an AlN substratum 11, a thin film conductor layer 13 formed on the AlN substratum 11, and I/O terminals 14 bonded to the thin film conductor layer 13 via soldering material. The average surface roughness Ra of the AlN substratum 11 is larger than or equal to 0.1mum. When the shortest distance between the bonded part end portions of the I/O terminals 14 and the outer periphery of the thin film conductor layer 13 is A, a relation A/Ra>=10 is established.</p> |
