Reaktionsharze zum Vergießen von druckempfindlichen elektronischen Bauelementen

摘要

For the potting of pressure-sensitive electronic components, the invention proposes that an epoxy/anhydride reaction-resin system with a high glass-transition temperature be modified with finely dispersed silicon-rubber particles and a vitreous fused silica filler with the optimum particle-size distribution in order to improve the modulus of elasticity, crack resistance and resistance to changes in temperature, while maintaining the resistance to moisture and chemicals at the same level.