发明名称 Sub-modular development system for modular computer-based instruments
摘要 An instrument module development system for a computer-based instrument system, which system includes a chassis with slots for receiving various instrument modules and a system bus with a conventional computer bus for conveying commands and data between a host computer and the instrument modules and with additional lines for conveying control signals and data between the various instrument modules, has a module housing for insertion into one of the chassis slots, a development board mounted therein, and a serial input/output (SI/O) board. The development board includes a conventional computer processor, ROM, and computer bus interface circuits all interconnected by an intramodule bus. Firmware in the development board ROM enables the module to communicate with the host computer through the system bus. User developed applications firmware in the development board ROM enables the processor to communicate with and control a user provided instrument board via the intramodule bus. The SI/O board is provided with a RAM, a ROM and a serial port accessible through the intramodule bus on the development board. A user operating a computer connected to the serial port downloads, tests and debugs an application routine in the SI/O board RAM. When the user has perfected the application routine, the user may burn the routine into a development board ROM and disconnect the SI/O board from the development board.
申请公布号 US5251150(A) 申请公布日期 1993.10.05
申请号 US19890297529 申请日期 1989.01.13
申请人 TEKTRONIX, INC. 发明人 LADNER, DESMOND C.;STOIANTSCHEWSKY, SPASS
分类号 G01R19/25;(IPC1-7):G06F15/20 主分类号 G01R19/25
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