| 摘要 |
<p>PURPOSE:To provide the wafer clamping mechanism for an apparatus for producing semiconductors which clamps the entire periphery of a wafer, such as silicon wafer by means of one driving mechanism in the state of facing its surface downward, is simple in constitution and can be produced at a low cost. CONSTITUTION:The wafer clamping mechanism 11 for supporting the wafer for the apparatus for producing semiconductors which transports and treats the wafer 3, i.e., a material to be treated in the state of facing its surface downward is so constituted as to include movable clamps 15 which are disposed to cover the entire periphery of the wafer 3, can be retreated so as not to come into contact with the transporting arm at the time of taking up the wafer from the top of the transporting arm 12 and imposing the wafer on the transporting arm and are formed to a 'V' shape.</p> |
