发明名称
摘要 <p>PURPOSE: To establish an inter-layer connection in good workmanship by configuring a multi-layer wiring assembly for use in a printed circuit board, molded wire board, or flex inter-circuit connector from a strand of carbon fibers covered and distributed and including small diametric carbon fibers or metallized carbon fibers. CONSTITUTION: Continued carbon fibers, i.e., strand 13, are accommodated in a host polymer 14 followed by melting and the obtained electroconductive fibers are used as wirings. That is,a composite covering member 12 of a plurality of continuous carbon fibers, for example, having a diameter of 0.050 inch, is laid and worked for forming an electroconductive inter-connection. The positioning is made between a pair of printed circuit boards 31 and 32 installed on the oversurface and undersurface of an inter-layer connector dielectric substance base board 10, and into a through hole 17 provided there the composite covering member 12 is inserted and fixed with a laser beam. The composite member 12 is cut into a length enough to make inter-connection of conductors 30 and 33 of two boards 31 and 32.</p>
申请公布号 JPH05251121(A) 申请公布日期 1993.09.28
申请号 JP19920352020 申请日期 1992.12.09
申请人 XEROX CORP 发明人 JIYOSEFU EI SUUIFUTO;SUTANREI JIEI WARESU
分类号 H01R11/01;H01R12/52;H05K3/32;H05K3/36;(IPC1-7):H01R11/01;H01R9/09 主分类号 H01R11/01
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