发明名称 SUBSTRATE ASSEMBLY
摘要 PURPOSE:To electrically connect substrates superposed vertically by preparing a plurality of substrates, on whose upper surfaces card edge connectors having both upper insertion holes and lower insertion holes are mounted, and inserting a connecting substrate having a broad width part on the central part into the card edge connector. CONSTITUTION:A plurality of substrates 2A to 2C, on which card edge connectors 1 are mounted, are arranged in a multistage state by using a connecting substrate 5 so as to enable the constitution of a substrate assembly. The parts except the card edges 52 or 53 in the connecting substrate 5 are broad, so that the positioning of the connecting substrate 5 in the vertical direction is easy. The arrangement spacing between the upper and lower substrates can be decided according to the length of a broad part 51 of the connecting substrate 5 and the height of the card edge connector 1, resulting in the stabilization of the substrate 2.
申请公布号 JPH05251142(A) 申请公布日期 1993.09.28
申请号 JP19930009982 申请日期 1993.01.25
申请人 OKI ELECTRIC IND CO LTD 发明人 KIKUCHI KO;TANUMA JIRO;AKUTSU NAOJI
分类号 H01R12/18;H01R12/16;(IPC1-7):H01R23/68;H01R23/68 主分类号 H01R12/18
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